Honeywell has developed a line of electronic components designed to meet the stringent reliability requirements for computers operating in technically advanced military and commercial aerospace conditions. Honeywell’s microelectronics product offering includes next-generation integrated circuits manufactured to withstand the shock, vibration and extreme radiation conditions that occur in space and other military environments. The components are developed using Honeywell’s radiation-hardened, silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology. Silicon wafers are used to make Application Specific Integrated Circuits (ASIC) and memory components, which are subsequently used in commercial and military avionics systems, payload electronics for commercial and military space systems, inertial measurement units, flight control systems, circuit replacement programs and many other aerospace systems. All of the new components are produced at Honeywell’s Trusted Foundry in Plymouth, Minn. The new microelectronic produce line includes HX5000, a 12-million gate ASIC specifically designed for radiation-tolerant and radiation-hardened applications; HXSRO1608, a 16-million bit Static Read Access Memory (SRAM) that provides a memory function four times the memory density than earlier SRAM components; HXNVO100, the first non volatile Magnetic RAM (MRAM) to combine SOI CMOS technology with magnetic thin films; and RHPPC Processor, a single-package, radiation-hardened component for space borne electronic systems based on Freescale’s 603e processor.