Sequans LTE Chipset Tech to Power EAN’s LTE Access Device

By Juliet Van Wagenen | May 4, 2016
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Sequans LTE chipset
Sequans LTE chipset. Photo: Sequans

[Avionics Today 05-04-2016] Thales has selected Sequans Communications’ LTE chipset technology to power LTE access devices for airplanes as part of the European Aviation Network (EAN) high-speed in-flight broadband access solution. Inmarsat and Deustche Telecom, the companies that first envisioned the EAN, selected Thales to develop the ground component for the In-Flight Connectivity (IFC) network. Thales will fit the LTE access devices, called Complementary Ground Component (CGC) terminals, onto aircraft flying over Europe and will connect to the ground-based 3rd Generation Partnership Project (3GPP) LTE network.

Sequans is providing Thales with LTE chipsets based on Release 10 of the 3GPP LTE standard. The solution supports key adaptations specifically designed to support the in-flight application, including high-speed profiles, high-transmitted power, and extended cell size support.

EAN aims to offer European airlines reliable onboard Internet access to passengers across Europe’s high-traffic flight paths, using Inmarsat’s S-band spectrum allocation in all 28 EU member states. Development work is scheduled for completion in March 2017 with system trials and commercial service commencing afterward.

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